Today at Cellular Repair School we will understand which types of solder we should be using when soldering.
Lets start by understanding exactly what solder is.
Solder is a metal or metallic alloy used to join metallic surfaces when melted. There are generally two types of solder; a tin/lead mixture and a lead free alloy.
The most common tin/lead mixture is typically a 63/37 split. Sixty three percent being tin and 37 percent being lead. What’s different with a tin/lead mixture vs a lead free alloy is the melting temperature of the tin lead is going to be significantly lower than the lead free.
This helps with not having to have higher heat to effectively solder your components which leads to higher risk of damage to the logic board and components as well as shorting the life of your soldering tip.
A lead free alloy is going to require 20 to 45 degrees more heat to reach the same melting point of a tin/lead mix.
To learn more about the differences and similarities of different types of solder, such as when to use wire solder vs solder past check out the video below.
Chaplain Eyre an instructor at Cellular Repair School discusses in more detail what solder is and how it should be used in the cell phone repair process.
Be sure to leave questions or comments below. You can also vist our “Face Book page”